전도성 접착제 Conductive Adhesive
 CHO-BOND series  

CHO-BOND 1075 

Parker Chomerics CHO BOND 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity. CHO BOND 1075 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (100 PSI lap shear strength) is required.

Features and Benefits:
• One-component system so no mixing or measuring required
• Excellent electrical conductivity levels (0.010 ohm-cm)
• Outstanding galvanic corrosion resistance against aluminum substrates
• No corrosive by-products generated during drying
• No volatile organic compounds (VOCs)
• Medium consistency paste makes the material dispensable in overhead or vertical applications
• No pressure required when curing to achieve proper bonding

CHO-BOND 1030

Parker Chomerics CHO-BOND 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates. CHO-BOND 1030 is a light grey-colors silicone paste that is predominantly used for bonding elastomer gaskets.

Features and Benefits:
• One component system so no mixing or measuring required
• Silver-plated copper filler is a low cost solution to electrical bonding
• Good conductivity levels (0.050 ohm-cm)
• Moderate adhesion properties ( >200 PSI lap shear strength)
• Medium paste consistency means it can be used on overhead or vertical surfaces
• No volatile organic compounds and no corrosive by-products generated when curing


CHO-BOND 1035

Parker Chomerics CHO BOND 1035 is a one-component, silver-plated glass filled sealant formulated to provide lightweight EMI shielding in commercial and military applications. CHO BOND 1035 is a beige-colored silicone that provides a flexible, conductive, and environmental seal but it not recommended for high vibration environments.

Features and Benefits:
• One-component system so no mixing or measuring required
• Low cost solution for good conductivity (0.050 ohm-cm)
• No corrosive by-products generated during drying
• Minimal weight added to assembly due to lightweight material
• Thin paste makes the material very easy to dispense, apply, and spread
• No pressure required when curing to achieve bond


PRO-SHIELD 7058

Parker Chomerics PRO-SHIELD 7058 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

PRO-SHIELD 7058 is recommended for relatively small bond lines (less than 0.010 inches (0.25mm)), but can be used for larger bond lines in applications where vibration or potential for cracking is not an issue. The fine silver filler of PRO-SHIELD 7058 makes it a good material choice for precise application in and around tight spaces and electrical components.

PRO-SHIELD 7058 comes in a 50cc dual syringe with a static mixer, minimizing material scrap and mixing issues. Curing of PRO-SHIELD 7058 can be achieved in as little as 15 minutes with heat to minimize equipment downtime and increase manufacturing throughput.

Typical applications:
• Bonding and grounding of electrical components
• Cold soldering
• Bonding and sealing machined enclosures